Micro-Fit 3.0 Side-Mounted Double Row Header Tinned 100u" Internal Structure of Electronic Devices

Product Details
Customization: Available
Type: Socket Terminals
Material: Copper
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  • Micro-Fit 3.0 Side-Mounted Double Row Header Tinned 100u" Internal Structure of Electronic Devices
  • Micro-Fit 3.0 Side-Mounted Double Row Header Tinned 100u" Internal Structure of Electronic Devices
  • Micro-Fit 3.0 Side-Mounted Double Row Header Tinned 100u" Internal Structure of Electronic Devices
  • Micro-Fit 3.0 Side-Mounted Double Row Header Tinned 100u" Internal Structure of Electronic Devices
  • Micro-Fit 3.0 Side-Mounted Double Row Header Tinned 100u" Internal Structure of Electronic Devices
  • Micro-Fit 3.0 Side-Mounted Double Row Header Tinned 100u" Internal Structure of Electronic Devices
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  • Overview
  • Product Description
Overview

Basic Info.

Model NO.
PZSM-B04B24P-P42T3-40LH
Character
Insulation
Species
Terminal
Production Process
Injection Molding
Shape
Rectangular
Interface Type
SCSI
Certification
RoHS
Brand
Shuangyi
Leakage
3.2mm
Plating
Tinned
Feature
Side-Mounted
Area
Electronic Industrial Area
Transport Package
DIP
Specification
2*12p
Trademark
ShuangYi
Origin
China
HS Code
8503009090
Production Capacity
50000/Year

Product Description

Product Description

Product Description:
Product Name Micro-FIT 3.0 Side-mounted double row header tinned 100U"
Application electronic Industrial area
Pin 2*12p
 

Basic Information:

  • Product Model: Micro-FIT 3.0 Side-mounted Double Row Header Tinned 100U
  • Series: Micro-FIT 3.0 Series
  • Pin Finish: Tinned
  • Mounting Type: Side-mounted
  • Number of Rows: Double

Core Features:

  1. High Contact Density:
    • Designed with a 3.00mm (0.118") pin pitch, the Micro-FIT 3.0 Series achieves high contact density, suitable for applications requiring tightly packed connectors.
  2. High Current Carrying Capacity:
    • Capable of carrying relatively high currents, with varying specifications ranging from 3A to 8.5A depending on sources, making it suitable for circuits requiring the transmission of substantial power.
  3. Tinned Pins:
    • The pins are plated with tin, enhancing conductivity and corrosion resistance, thereby prolonging the connector's lifespan.
  4. Fully Isolated Terminals:
    • The terminals are fully isolated, preventing potential damage during handling and mating, ensuring stable and reliable connections.
  5. Side-mounted Design:
    • The side-mounted layout conserves space on the circuit board, facilitating easier integration into compact electronic devices.
  6. Double Row Layout:
    • The double row pin configuration offers more connection points, catering to applications requiring multiple signal or power channels.

Application Areas:

  • The Micro-FIT 3.0 Series connectors are widely used in various electronic devices, including but not limited to computers, workstations, satellite communication equipment, mobile phones, consumer electronics (such as washing machines, dryers, fridges, game consoles, printers, scanners, etc.), security systems, vending machines, white goods, medical devices, and telecommunications/networking equipment.
Micro-Fit 3.0 Side-Mounted Double Row Header Tinned 100u" Internal Structure of Electronic DevicesMicro-Fit 3.0 Side-Mounted Double Row Header Tinned 100u" Internal Structure of Electronic DevicesMicro-Fit 3.0 Side-Mounted Double Row Header Tinned 100u" Internal Structure of Electronic DevicesMicro-Fit 3.0 Side-Mounted Double Row Header Tinned 100u" Internal Structure of Electronic DevicesMicro-Fit 3.0 Side-Mounted Double Row Header Tinned 100u" Internal Structure of Electronic DevicesMicro-Fit 3.0 Side-Mounted Double Row Header Tinned 100u" Internal Structure of Electronic Devices
 

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